Universal BoLink enclosures from BOPLA

The German Bopla company (part of the Phoenix-Mecano Company), has an experience of over 40 years in the manufacture of enclosures and belongs to the leaders of its industry in the European market. Bopla offers universal and desktop enclosures, enclosures made from aluminium profiles, 19” enclosures and enclosures for portable electronic devices. Many of these products are available directly from the TME warehouses – and recently a new series of BoLink enclosures has been added to this range.

BoLink enclosures are made from the PC UL 94 V0 polycarbonate. Because the base and the cover are connected using a seal, the products are characterized by a high ingress protection rating – IP65, thanks to which they can be used in difficult environmental conditions: pollinated places and spaces where the target device may become wet. Products from the BoLink series will be a good choice for a wide range of IoT devices and sensors, in portable devices and during the construction of small pieces of electronic equipment. Thanks to the ease of processing and high durability, they can also be recommended for the low-cost manufacture and amateur projects.

Enclosures are available in two colours: black and white, and in three sizes: 42.4x70.4x15.5mm and 42.9x70.9x22mm and 43.2x71.2x26mm. Clients can choose between standard models and those equipped with mounting brackets, which make a quick installation of the device easier, for example on the wall of a building.

Universal BoLink enclosures  

* depending on the model

Product overview