Bungard is a German manufacturer of solutions for both professional and low-volume manufacture of electronic prototypes. The range of Bungard products that are available at TME has been recently expanded to include laminates for PCB making. They can be used in production facilities as well as by students or beginners.
The laminates are available in single-sided and double-sided versions. They are made from fiberglass-reinforced epoxy resin (FR4) or phenolic resin combined with hard paper (FR2). The thickness of the laminates varies from 0.5 to 2.5 mm, and their sizes range from 100 x 75 mm to 570 x 510 mm, with a choice of various copper clad thicknesses: 18 µm, 35 µm and 70 µm.
The laminates presented here have been factory-adapted for PCB making using the photo-transfer (UV resist) method. The boards have been clad with a photoresist, i.e. light-sensitive material, and a protective foil, thanks to which the laminate remains undamaged during storage.
| Specification | |
|---|---|
| Type of board | laminate |
| Material* | FR2 (hard paper), FR4 (epoxy resin) |
| Board variant* | single-sided or double-sided |
| Laminate thickness | 0.5…2.5 mm |
| Length* | 100…570 mm |
| Width* | 75…510 mm |
| Kind of board cladding | copper, light-sensitive coating |
| Copper clad thickness* | 18 µm, 35 µm or 70 µm |
* depending on the model
